功率半導體模塊是新能源汽車中的核心部件之一,目前絕大多市場份額為國際巨頭所壟斷,而國產功率模塊性能尚無法滿足汽車核心裝備應用,主要原因之一是可靠性有待提升。
測試周期:
2-3個月,提供全面的認證計劃、測試等服務
產品范圍:
適用于MOSFET,Diode,IGBT,第三代半導體器件等元件構成的功率模塊。
測試項目:
| 序號 |
測試項目 |
縮寫 |
樣品數/批 |
測試方法 |
| 1 |
Thermal shock test |
TST |
6 |
IEC 60749-25 |
| 2 |
Vibration |
V |
6 |
DIN EN 60068-2-6 |
| 3 |
Mechanical shock |
MS |
6 |
DIN EN 60068-2-27 |
| 4 |
Power cycling |
PCsec |
6 |
IEC 60749-34 |
| 5 |
Power cycle |
PCmin |
6 |
IEC 60749-34 |
| 6 |
High-temperature storage |
HTS |
6 |
IEC 60749-6 |
| 7 |
Low-temperature storage |
LTS |
6 |
JEDEC JESD-22 A119 |
| 8 |
High-temperature reverse bias |
HTRB |
6 |
IEC 60747-9 |
| 9 |
High-temperature gate bias |
HTGB |
6 |
IEC 60747-9 |
| 10 |
High-humidity, high-temperature reverse bias |
H3TRB |
6 |
IEC 60749-5 |
| 11 |
Determining parasitic stray inductance |
Lp |
6 |
IEC 60747-15 |
| 12 |
Determining thermal resistance |
Rth |
6 |
DIN EN 60747-15 |
| 13 |
Determining short-circuit capability |
/ |
6 |
/ |
| 14 |
Insulation test |
/ |
6 |
/ |
| 15 |
Determining mechanical data |
/ |
6 |
/ |